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SMTA-San Diego Issue #02(June 2008)
8 pages
Publié par
smta.sandiego
Copyright :
Tous droits réservés
SMTA Officers
San Diego
President
Tom Wittmer
Vice President
Mumtaz Bora
Secretary
Juan Arteaga
Treasurer
Julie Bradbury-Bennett
Membership
Zen Barelka
NEXT
MEETING
Wednesday
June 11, 2008
5:30 – 6 PM Social
Hour
6 -7...
[Plus]
SMTA Officers
San Diego
President
Tom Wittmer
Vice President
Mumtaz Bora
Secretary
Juan Arteaga
Treasurer
Julie Bradbury-Bennett
Membership
Zen Barelka
NEXT
MEETING
Wednesday
June 11, 2008
5:30 – 6 PM Social
Hour
6 -7 PM Dinner
Provided by SMTA
7-8:00PM Presentation
Asymtek
2762 Loker Eve West,
Carlsbad, CA 92010
Cost:
Members: $15
Non-Members: $25
Info: www.
smta.
org
The increase in functionality of mobile electronics is resulting in a
greater number of Printed Circuit
Board Assemblies requiring underfill
epoxy for product reliability.
The
term underfill references an epoxy,
typically two part with a thermal cure
mechanism, that flows underneath a
component to increase the device
longevity due to greater mechanical
rigidity.
Initially underfill was used to
compensate for the difference in coefficient of thermal expansion between a bare die and the substrate in
a direct chip attach use model (DCA
or Flip Chip), however, with thinner
PCBs
[Moins]
Tags
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june,
manufacturing,
meeting,
members,
membership,
presentation,
president,
process,
product,
smta,
technologies,
thermal,
underfill
